Description (KimiScrub 100):

SAS-KimiScrub100 is a unique solution for removing photoresist from surface of metals with a pH of 5 to 6. .  The SAS KimiScrub100 is an alternative cleaning process to ASH process and  preventing formaiton of any metal oxidation. 

The SAS KimiScrub100 is also an alternative photoresist stripping solution to all alkaline photoresist strippers.  Use of any agitating process such as Jet Spray or Mega Sonic systems will increase the effectiveness of SAS-KimiScrub100 solutions.

Main Characteristics:

Due to the unique neutral pH property of this solution, no chemical reaction can happen between SAS-KimiScurb100 and Thin Films Metals underneath of a photoresist.

1. Good Cleaning Power
2. High thermal Stability
3. High Chemical Stability
4. High Water Solubility
5. High Wetability Power
6. Non-Flammable
7. Wide Cleaning Applications
8. An alternative solution for replacement of ASH and Piranah

Description (KimiScrub 200):

SAS-KimiScrub 200 is an Alkaline solution with a pH around 14. This solution is a very strong solution for removing hard baked Photoresist or Photoresist with exposure to high dose of RI (Reactive Ions).

Main Characteristics:

Very powerful solution for cleaning nano pattern electronic devices. Use of any agitating process such as a Mega-Sonic system will increase the effectiveness of KimiScrub 200 Solution.

1. Good Shelf life
2. Easy to Remove Photoresist in a high dose of RI
3. None Flammable
4. High Water Solubility
5. High Rinse-ability