SAS's Product Names

PH

Environmental Status

Cleaning Applications

This solution series are used for cleaning or etching the most Metal-Ligands and Metal to Metal bonded layers. SubScrub50 solutions are formulated with surfactant (SubScrub50S) and without Surfactant (SubScrub50).

In case of edge-line metal protection or metal lifting problem, SubScrub50S is mostly recommended.

Inorganic
(For metal particles)

This product is one of the best cleaning product for removing metal particles from the Silicon as well as Silica surfaces. 

Combination of SubScrub100 followed by SurfPurge14 is highly recommended for a better cleaning performance.

SubScrub 250
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2 to 3

Organic

Sub Micron Particle Removal, Organic Thin Film Cleaner with Low Foam Surfactant, A good cleaner for Glass Wafer, Glass Disk, Ceramic, and Solar Technologies with and without metal thin films.

SubScrub 300
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4 to 5

Organic

Sub Micron Particle Removal, Organic Thin Film Cleaner, A good cleaner for Glass Wafer, Glass Disk, Ceramic. More for the pH sensitive surfaces, and Solar Technologies with and without metal thin films.

SurfPurge Series
(click for more info)

8 to 14

Inorganic

Sub Micron Particle Removal for Aluminum, Chromium, Chromium Oxide, Ni/P & glass Surface Cleaning.

SurfPurge 10A [Solar]
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10 to 11

Inorganic / Organic

Sub Micron Particle Removal for Aluminum, Chromium, Chromium Oxide, Ni/P & Solar Module Surface Cleaning.

SurfClean Series
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10 to 14

Organic

Optimal High Molecular Weight Organic Cleaner for removing Grease, Pen Marks, Dust Particles, Finger Prints, especially for Pores surfaces such as Ceramic materials.

An Alternative Solution for Replacement of Acetone & Alcohols.

pH 14 is a Photoresist Stripper for all PR pre-exposed to Plasma Etch

SAS Products Name

PH

Environmental Status

Cleaning Applications

KimiRub 14 Series
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13-14

Inorganic / Organic

KimiRub 14 is an alternative solution for SC1 replacement with an advanced cleaning power, mostly to clean Photomasks and carbon surfaces without the use of scrubber or brushes.

KimiRub14S functions the same as KimiRub 14 and mostly used during CMP process.

PolyScrub
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2 to 3

Inorganic / Organic

An Excellent solution for removing hard to removed Silicon Polymers after a high dose of RI exposure during a Dry Etch process.
Mostly it is used for cleaning surface of optical devices (Wave Guides) after a Dry Etch, Deep Trenches.
In addition, PolyScrub can be used as an alternative solutions for replacement of 3-Mixed Solutions with a more advanced cleaning Power.

A Good PR Cleaning Solution for Cleaning Standard Baked Photo-resist at room temperature.

An alternative solution for replacement of Piranha at high temperature after ASH process.

KimiScrub 200
(click for more info)

13 to 14

Inorganic / Organic

A Good PR Cleaning Solution, for Cleaning Hard to Removed Photoresist films after High Dose RI exposure, High beaked Photoresist and finally nano-patterned disks and wafers.